Volume : 60g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA, and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reball.
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages, and flip-chip operation
Suitable for multiple PCB reflow
No-clean and Lead-free for environmental protection