KAISI-A8 3D STENCIL

Feature:

• Stepped groove design enables stencil to align with tinning position of IC rapidly.
• The square holes design makes it easier to take out the formed solder balls.
• This 3D stencil is easy to use no matter you are a new or expert.
• High success rate of planting tin,the solder balls can be formed once after you are proficient.
• This 3D planting stencil is thicker than ordinary stencil in the market.Less tendency of deformation makes its using life be longer.