KAISI-A9 3D STENCIL
- Stepped groove design enables stencil to align with tinning position of IC rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter you are a new or expert.
- High success rate of planting tin,the solder balls can be formed once after you are proficient.
- This 3D planting stencil is thicker than ordinary stencil in the market.Less tendency of deformation makes its using life be longer.