New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.
The viscosity is moderate, there is almost no patch collapse, and the components do not shift.
Good wettability & Good weldability High-end quality, a unique formula, perfect performance.
Suitable for a variety of welding environments, a wide range of applications, with high compatibility.
The storage time is up to 12 months in a refrigerated environment. Unique high-quality solder tin paste(the best configuration ingredients: Sn42/Bi58) make the adhesion is long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours.
The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance.
Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.
Uncompromising performance in an ultra light ultra body, heavyweight performance without the weight. Fine and flexible packaging, delicate appearance.
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