MECHANIC SOLDER PASTE ROOM TEMPERATURE MELTING POINT 183 FLUX EASY WELDING STRONG MEDIUM TEMPERATURE SOLDER PASTE.
- New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
- Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.
- The viscosity is moderate, there is almost no patch collapse, and the components do not shift.
- Good wettability & Good weldability High-end quality, a unique formula, perfect performance.
- Suitable for a variety of welding environments, a wide range of applications, with high compatibility.
- The storage time is up to 12 months in a refrigerated environment. Unique high-quality solder tin paste(the best configuration ingredients: Sn42/Bi58) make the adhesion is long-lasting, it is not easy to dry, and the viscosity time is up to 48 hours.
- The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance.
- Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.
- Uncompromising performance in an ultra light ultra body, heavyweight performance without the weight. Fine and flexible packaging, delicate appearance.