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RELIFE RL-404 138° SOLDERING PASTE

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259.98

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RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin

  • Meet the maintenance needs of motherboards for Samsung, Oppo, Vivo,Redmi and Apple etc. high-end machines
  • A low temperature lead-free solder paste customized for high-end motherboard repair
  • RL-404 138 ° C low temperature solder paste

 

Weight .050 kg
Type

Combination

Origin

CN(Origin)

Model Number

RELIFE RL- 404

Package

Case

Application

Computer toolkit

Size

Standard

Melting point

138 degrees

Cost

Lead-free

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