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RELIFE RL-421-OR is a high viscosity lead free solder paste designed for soldering and reballing SMD components and PCB.

1.Imported rosin ,no virtual welding, easy to tin

2.The color is pure, no impurities

3.Running tin is fast and has less smoke

4.High insulation resistance, suitable for mobile phone PCB,CPU repair

10CC RL-421-OR Strong activity BGA Flux Paste for PCB, SMD, BGA Reballing Soldering, Relife RL-421-OR Soldering Paste Flux can be used for soldering and reballing of computer and phone chips. It is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. Help to repair the circuit boards and protect the electronic components. A necessary material for repairing the mobile phone mainboard
Imported rosin, no virtual welding, easy to tin.
The color is pure, no impurities.
Running tin is fast and has less smoke.
High insulation resistance, suitable for mobile phone PCB,CPU repair.
Weight 0.05 kg

10 cc

Tube dimensions

35 × 120 mm

Packing dimensions

56 × 150 mm


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