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AKT VVS-150 ADVANCED QUALITY PASTE FLUX

Items Sold ! 173

Brand: AKT 
Model: VVS-150
Volume : 60g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA, and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reball.
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages, and flip-chip operation
Suitable for multiple PCB reflow
No-clean and Lead-free for environmental protection

69.98

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AKT VVS-150 ADVANCED QUALITY PASTE FLUX

  • Flex paste and liquid are used to remove oxidation (= ease of tinning of parts) from the printed circuit fiber and the base of the parts.
  • Flex paste is a regenerating tin liquid that gives it a spherical or convex shape due to contact with tin.
  • The problem is cleaner work and better connections.
  • At the same time, it reasonably prevents the connection between the bases during assembly and removal, which with this property helps a lot to prevent the tin from spreading around the work (which causes the bases to be eaten together or the bases to be connected).
  • Flex paste also causes good heat dissipation, which increases the heat tolerance of the parts and prevents them from burning.

 

 

Weight 0.05 kg

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