2uul BH12 THE ONE PLATE Magnetic Curved Reballing Platform with Silicone Pad

The 2UUL BH12 THE ONE PLATE Magnetic Curved Reballing Platform is a professional chip-level repair tool designed for accurate BGA and IC reballing during mobile phone motherboard repair. Built for technicians and repair laboratories, this platform provides stable chip positioning, improved solder ball alignment, and efficient workflow when working with delicate smartphone components.

This high-precision reballing base features a strong magnetic fixation system that automatically aligns the stencil and chip, helping technicians achieve accurate solder ball placement. The powerful magnets securely hold the IC or motherboard in place, preventing movement during solder paste application or hot-air heating. This stability reduces solder bridging, improves reballing success rate, and ensures professional repair results.

The BH12 platform also includes a heat-resistant silicone pad, which provides anti-slip support and protects sensitive components from scratches or shifting during repair. The curved platform design improves chip positioning and allows better control during precision soldering and reballing operations.

Manufactured with durable, high-quality metal materials, the platform is designed to withstand the high temperatures generated by hot-air rework stations and soldering tools. Its robust construction ensures long-term reliability for frequent use in professional repair workshops.

Compact and easy to use, the 2UUL BH12 reballing platform is ideal for technicians working on iPhone, Android smartphones, tablets, and other electronic devices that require chip replacement or BGA rework. The platform improves repair efficiency and accuracy, making it a valuable tool for advanced motherboard maintenance and micro-soldering tasks.

Key Features

• Strong magnetic positioning system for stable IC and stencil alignment

• Curved reballing platform for improved chip positioning

• Heat-resistant metal construction for durability during high-temperature repairs

• Silicone anti-slip pad to protect delicate circuit boards

• Designed for BGA, IC, CPU, and NAND chip reballing

• Improves solder ball accuracy and repair efficiency

• Suitable for professional mobile repair technicians and repair labs