Description :  Feature:   Packing Details:  Overview




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| Weight |
0.3 kg |
|---|
The packing list includes 4 pieces of knife and 1 knife handle
* Model S: Separate the CPU and Nand flash
* Model E: Mobile phone motherboard IC CPU glue removal
* Model X: Professional edge glue removal tool
* Model Y: Cut the underfill black glue without hurting the motherboard.
 Description :  Feature:   Packing Details:  Overview




-
| Weight |
0.3 kg |
|---|
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