AMAOE M9 217° SOLDER PASTE

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₹579 ₹1100/pcs 47% off

Premium solder paste for precise electronic repairs.

Smooth solder flow with minimal residue performance.

Perfect solution for professional mobile motherboard repairs.

More product details

Reliable BGA soldering with excellent bonding strength.

High-quality flux improves solder joint durability consistently.

Ideal solder paste for SMD PCB assembly.

Low temperature formula protects delicate electronic components.

Professional repair paste for accurate soldering applications.

Excellent wetting performance ensures reliable solder connections.

Trusted solder paste for electronics repair professionals.

In stock ·Brand Amaoe ·SKU 12856
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Overview

The AMAOE M9 217°C Solder Paste is a premium-quality soldering solution designed for professional mobile phone repair, PCB rework, BGA reballing, SMD soldering, and electronic component assembly. Its low melting point of 217°C ensures smooth solder flow, excellent wetting performance, and strong solder joints while minimizing thermal stress on delicate electronic components.

Formulated with fine solder particles and high-activity flux, the AMAOE M9 solder paste delivers clean soldering with minimal residue, making it ideal for smartphone motherboards, IC repair, CPU reballing, laptop repairs, and precision electronic maintenance. Whether you're a professional technician or an electronics enthusiast, this solder paste provides reliable performance for high-precision soldering applications.


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Key Features

  • Premium 217°C low-temperature solder paste
  • Excellent wetting and solder flow
  • Strong and durable solder joints
  • Low residue after soldering
  • Ideal for BGA, SMD, SMT, and PCB repair

  • Reduces overheating of sensitive components
  • Improves solder joint reliability
  • Ensures precise electronic repairs
  • Suitable for professional repair technicians
  • Delivers consistent soldering performance

Specifications

Specification Details
Brand AMAOE
Model M9
Product Type Solder Paste
Melting Point 217°C
Application Mobile Phone Repair, PCB Repair
Suitable For BGA, SMD, SMT, IC Repair
Flux Type High Activity
Residue Low Residue
Soldering Performance Smooth & Strong Bond
Usage Professional Electronics Repair

5 Bullet Points

  • 217°C melting point for precision PCB soldering.
  • High-quality formula ensures excellent solder flow.
  • Low residue keeps circuit boards clean.
  • Perfect for BGA, SMD, and IC repairs.
  • Trusted by professional mobile repair technicians.

 

Weight

0.050 kg

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