JTX T4 Max Universal Chips Glue Removal and Tin Planting Platform Set

The JTX T4 Max Universal Chips Glue Removal and Tin Planting Platform Set is a versatile professional repair tool designed for efficient chip adhesive removal, IC preparation, and tin planting operations during mobile phone and PCB repair. Its universal platform design helps technicians securely position and handle chips, supporting more accurate and controlled repair work.

This multifunctional repair fixture is suitable for removing residual glue and preparing IC surfaces before reballing, soldering, or other chip-level repair procedures. The platform provides stable positioning, helping reduce unwanted movement while working on small electronic components. It is particularly useful for smartphone motherboard repair, IC reballing, BGA maintenance, and electronics repair applications.

The JTX T4 Max is designed for repair technicians, electronics workshops, and DIY users who need a practical platform for precision chip maintenance. Its compact design makes it convenient for workbenches and professional repair stations.

Whether you are performing IC glue removal, chip tin planting, motherboard repair, or reballing preparation, this platform set can improve workflow efficiency and provide better handling of delicate components.

• JTX T4 Max universal chip glue removal and tin planting platform for professional mobile repair.
• Designed for IC preparation, chip maintenance, and motherboard repair applications.
• Stable fixture supports precise glue removal and tin planting operations.
• Suitable for smartphone PCB repair, IC reballing, and electronics maintenance.
• Universal chip repair platform for technicians, repair shops, and DIY electronics users.