JTX T4 Max Universal Chips Glue Removal and Tin Planting Platform Set
Product Description
The JTX T4 Max Universal Chips Glue Removal and Tin Planting Platform Set is a versatile professional repair tool designed for efficient chip adhesive removal, IC preparation, and tin planting operations during mobile phone and PCB repair. Its universal platform design helps technicians securely position and handle chips, supporting more accurate and controlled repair work.
This multifunctional repair fixture is suitable for removing residual glue and preparing IC surfaces before reballing, soldering, or other chip-level repair procedures. The platform provides stable positioning, helping reduce unwanted movement while working on small electronic components. It is particularly useful for smartphone motherboard repair, IC reballing, BGA maintenance, and electronics repair applications.
The JTX T4 Max is designed for repair technicians, electronics workshops, and DIY users who need a practical platform for precision chip maintenance. Its compact design makes it convenient for workbenches and professional repair stations.
Whether you are performing IC glue removal, chip tin planting, motherboard repair, or reballing preparation, this platform set can improve workflow efficiency and provide better handling of delicate components.
Specifications Table
| Specification | Details |
|---|---|
| Brand | JTX |
| Model | T4 Max |
| Product Type | Universal Chip Repair Platform Set |
| Main Function | Chip Glue Removal & Tin Planting |
| Application | Mobile Phone & PCB Repair |
| Compatibility | Universal / Multiple Chip Sizes |
| Suitable For | IC Chips, Motherboards, PCB Components |
| Material | Durable Repair-Grade Construction |
| Design | Stable Positioning Platform |
| Usage | Glue Removal, Tin Planting, IC Preparation |
| Application Level | Professional & DIY Repair |
| Package Type | Platform Set |
| Color | As Shown in Product Images |
Key Features
- Universal platform design for various chip repair applications.
- Supports efficient IC glue removal and surface preparation.
- Helps stabilize chips during tin planting and repair work.
- Suitable for smartphone motherboard and PCB repairs.
- Practical solution for IC reballing and chip-level maintenance.
Benefits
- Improves repair accuracy: Provides stable chip positioning during precision work.
- Saves working time: Helps organize repetitive glue removal and tin planting tasks.
- Versatile compatibility: Suitable for different chip and motherboard repair applications.
- Professional workflow: Ideal for repair shops, technicians, and electronics workshops.
- Compact workbench solution: Easy to incorporate into existing mobile repair equipment.
5 SEO Bullet Points
- JTX T4 Max universal chip glue removal and tin planting platform for professional mobile repair.
- Designed for IC preparation, chip maintenance, and motherboard repair applications.
- Stable fixture supports precise glue removal and tin planting operations.
- Suitable for smartphone PCB repair, IC reballing, and electronics maintenance.
- Universal chip repair platform for technicians, repair shops, and DIY electronics users.

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| Weight |
0.450 kg |
|---|

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