LANRUI CT80 Fill Active Solder Balls 25000Pcs Micro BGA Solder Beads for Android Motherboard Repair

The LANRUI CT80 Active Solder Balls are made for mobile phone motherboard repair, BGA reballing and micro?soldering. The set contains 25,000 precision solder beads giving technicians a supply for many repair and rework jobs.

The LANRUI CT80 Active Solder Balls work well for Android motherboard repair IC reballing, chip replacement and PCB?level servicing where accurate solder placement's essential. Their small uniform beads help technicians make solder connections during BGA rework when paired with the right stencils, flux and rework tools.

The LANRUI CT80 Active Solder Balls are especially helpful for mobile repair technicians, electronics repair workshops and DIY electronics hobbyists who work on circuit boards. The large quantity makes the set convenient for repair work and cuts down on frequent replacement.

For results choose the right size of LANRUI CT80 Active Solder Balls for each IC or motherboard application. Use proper temperature control during reflow. The LANRUI CT80 Active Solder Balls are a consumable, for precise BGA motherboard repair and professional electronics rework.

• 25,000-piece solder ball set for professional BGA rework.
• Ideal for Android motherboard repair and IC reballing.
• Micro solder beads support precise PCB repair applications.
• Suitable for mobile repair shops and electronics technicians.
• Compatible with appropriate BGA stencils and rework equipment.