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Lanrui M191 Dual Mode Power On Tool Universal Switch Clip for Mobile Motherboard Testing iPhone & Android
The Lanrui M191 is a specialized diagnostic and testing tool designed for mobile repair professionals. It features a dual-mode power-on system that allows for safe and efficient motherboard testing across a wide range of devices, including both iPhone and Android platforms.
Product Specifications
| Feature | Detail |
| Product Name | Dual Mode Power On Tool / Universal Switch Clip |
| Model | M191 |
| Brand | Lanrui |
| Compatibility | Universal (iPhone & Android Motherboards) |
| Operation Mode | Dual Mode (Manual / Automatic Trigger) |
| Material | High-Grade Purple PCB / Integrated SMD Components |
| Connectivity | Alligator Clip / VIN+ VIN- Solder Pads |
| Markings | YND-087-V1.6 / Pb-Free Certified |
| Main Function | Motherboard Boot Simulation & Current Testing |
Operational Capabilities
| Function | Description |
| Dual Mode Power-On | Supports both traditional manual switch triggering and automated power-on sequences for rapid diagnostics. |
| Universal Testing | Designed to work with various DC power supplies to bypass the need for a physical battery during repair. |
| High-Precision IC | Features integrated circuits to stabilize voltage and prevent surge damage to sensitive smartphone CPUs. |
| Lead-Free Build | Complies with professional environmental standards with a "Pb" free certification. |
| Flexible Wiring | Equipped with a durable black cable and high-tension alligator clip for secure grounding and power delivery. |
Key Features and Benefits
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Broad Device Support: Engineered to be a "one-stop" solution for technicians handling various smartphone brands, reducing the need for multiple brand-specific boot cables.
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Precision Engineering: The PCB (Model YND-087-V1.6) is populated with high-quality resistors and capacitors to ensure clean power delivery to the motherboard.
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Safety First: Includes reverse polarity protection and voltage stabilization to ensure that the motherboard is not damaged during the testing phase.
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Compact Design: The slim profile allows it to be used under microscopes or in tight work environments common in micro-soldering and motherboard repair.
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Clear Labeling: Features clearly marked "OUT+", "OUT-", "VIN+", and "VIN-" points for error-free soldering or clip attachment.
| Weight |
0.090 |
|---|
Customer Reviews
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