Maant Ip16-Plus-Pro-Max Stencil
The MaAnt 0.12mm Square?Hole BGA Reballing Stencil for the iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max (A18 series) is a precision tool crafted for chip reballing tasks. Engineered with a high-strength alloy steel mesh, its square?hole, chamfered design ensures burr-free tin application. Flexible yet resilient, it withstands heat and frequent use—making it ideal for CPU, NAND, Wi?Fi, Baseband, and NFC component repairs.
Feature | MaAnt 16?Series Only Stencil | ||
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Model Coverage | iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max | ||
Primary Use Case | Focused reballing for 16-series chips | ||
Hole Size | 0.12?mm square | ||
Material | Alloy steel | ||
Durability | High-temperature resistant and flexible | ||
Precision | High accuracy, burr-free | ||
Packaging | Single stencil |
Weight |
0.030 |
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