MECHANIC IBGA MAX 6IN1 PLANTING PLATFORM

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₹1698 32% off ₹2500

* Brand: MECHANIC.

* Item NO: iBGA Max.

* Size: 97*76*20mm.

* LEAK-PROOF TIN DESIGN.

* Support IP X/XS/XS MAX/11/11PRO/11PRO MAX.

* Model: Automatic positioning tin-planting platform for the mid-level motherboard.

* To prevent the tin paste from dropping on other parts, Effectively protect the motherboard of mobile phones.

* Automatic positioning, No offset, Accurate and fast, So that the maintenance work efficiency is higher.

MECHANIC iBGA Max 6in1 Planting Platform Middle Automatic positioning Tin Planting Platform Fixture For iPhone Mobile Phone IPX XSMAX IP11 11PRO MAX

Strong magnetic automatic positioning function, built-in strong magnetic adsorption, precise alignment without offset.
Leakage in barrier design, equipped with a leak-proof tin plate, and the mobile phone motherboard is protected from damage.
Special grade steel mesh material, high-temperature resistance of 500 degrees Celsius, no bulging, no deformation.
Intelligent value tin, powerful functions are integrated, and easy to operate.

Package :

1x BGA Reballing Platform

Weight	0.7

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