Mechanic Magtin X Magnetic Levitation CPU Degumming Tinning Platform

Features:

Mechanic MagTin X Magnetic Levitation CPU Degumming and Tinning 2-In-1 Platform for iPhone iOS A10/A11/A12/A13/A14/A15/A16/A17/A18 Pro, Huawei HiSilicon CPU and Qualcomm Snapdragon CPU black glue removal and tin planting repair. High temperature resistant stone and steel stencil for bright and full soldering joints.

• CPU degumming for iPhone and Android models, can used with Mechanic CPU degumming liquid brush, which quickly removes CPU chip black glue, is safe, and without dropping points

• Strong magnetic levitation design, new adsorption experience, the built-in magnets in the platform have a strong adsorption force,

• Making the slider automatically clamped and accurately aligned under the action of the magnetic field

• CPU tinning bright and full solder joints, chip tinning steel stencil design is unique, can ensure that each solder joint is accurately placed in the predetermined position, the solder joints are firm and reliable, no false soldering phenomenon, which is bright and rounded

• Fully general-purpose various BGA chips support iPhone/Huawei/Qualcomm series various CPU chips, corresponding to different chip stencil repair

Synthetic stone made of nano-composite materials, it has excellent high-temperature resistance, the unique material can withstand temperatures up to 500?, effectively prevent static interference and corrosion, and wear-resistant properties