Mobile
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MECHANIC QC-20 BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner 20ml BGA-IC Repair Remove Liquid
\n\n1.20ml BGA IC Epoxy Glue Remover. \n\n2. It can help you soften and remove the resining/sealing glue of mobile phone BGA IC chip easily.\n\n 3. It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc. \n\n4. Will not damage your circuit board and components. Environmentally friendly and safe.\n\n 5. Does not contain any co-derivative substance of benzene with cause of leukemia. comfortable to wear\n\n \n\n
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| Weight |
0.100 |
|---|
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