Mechanic/Amaoe SAM-1 Stencil
The Mechanic/Amaoe SAM-1 is a high-precision BGA reballing stencil specifically engineered for the flagship generation of Samsung devices, primarily the Galaxy S8, S8+, and Note 8 series. It is a critical tool for technicians performing chip-level motherboard repairs, such as CPU transplants or fixing power-on issues.
Technical Specifications Overview
| Feature | Details |
| Brand | Mechanic / Amaoe (Collaborative Professional Series) |
| Model | SAM-1 |
| Material | Japanese Imported High-Tension Stainless Steel |
| Stencil Thickness | 0.12mm (Ultra-precise for high-density BGA) |
| Hole Type | Square-holed (Anti-bridge/Easy paste release) |
| Anti-Bulge Design | Heat-resistant alloy to prevent thermal warping |
| Finish | Matte Anti-Glare / Silver Polished |
| Hardness | High Elasticity (Resistant to permanent deformation) |
Detailed Chip Compatibility List
The SAM-1 is a multi-function stencil that covers the primary integrated circuits (ICs) for the Samsung 8-series flagship ecosystem, including both Global (Exynos) and US/China (Snapdragon) variants.
| IC Category | Components Supported |
| Processors (CPU) | Qualcomm MSM8998 (Snapdragon 835) / Exynos 8895 |
| Power Management | PM8998, PMI8998, PM8005, MAX77838 |
| Audio/Codec | WCD9341 Audio IC |
| RF & Signal | WTR5975 RF Transceiver, AFEM-9060, QM78038 |
| Charging/USB | SM5720, P9320S, and high-current Charging ICs |
| Memory Support | LPDDR4 RAM (layered on CPU) & UFS 2.1 Storage chips |
Professional Usage Guidelines
To ensure a 100% success rate during the reballing process:
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Preparation: Clean the IC surface thoroughly using a solder wick and flux cleaner. Any residual old solder will cause the stencil to sit unevenly.
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Paste Application: Use a medium-viscosity solder paste (e.g., Mechanic M9 183°C). Spread evenly with a firm scraper.
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Heat Control: Set your hot air station to approximately 330°C - 350°C with low airflow. Hold the stencil down with tweezers at the edges to ensure zero movement.
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Cleaning: After the solder balls have formed and cooled, clean the stencil immediately with 99% Isopropyl Alcohol. Do not let paste harden in the square holes.

| Weight |
0.020 |
|---|

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