RELIFE F-23 100g Solder Flux
1. Suitable for welding and ball planting of computer north and south bridges, graphics cards, mobile phone chips, video game chips, etc.
2. Good tinning property, high insulation resistance, easy to tin.
3. Easy to solder, easy to clear, no irritating odor, environmentally friendly solder resist rosin.
4. Quickly remove the oxide film on the welding surface, easy to weld, and prevents oxidation.
Weight |
0.15 |
---|
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