SUNSHINE SS-T12A CPU MOULD

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₹2048 32% off ₹3000

Adopting 185-degree layered process to remove the IP-X motherboard, not only from our fine analysis
of IP-X solder paste ,but depends on the special heating design and precise temperature control of SS-T12A.
SS-T12A only heats the area that the IP-X board needs to be removed to prevent improper heating.
Dual bayonet design, make sure the IP-X motherboard is stable on the stage.
High purity copper is used as a film to ensure uniform heat transfer and heat.
T12A-CPU:For iPhone 6-8plus cpu layering, motherboard de-gluing aid, needs to be used with

SUNSHINE SS-T12A CPU MOULD 1

Weight	0.450

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