Amaoe GLE1 Stencil For Google Tensor Cpu

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Amaoe GLE1 Stencil for Google Tensor CPU – FAQ

Q1: What is the Amaoe GLE1 Stencil used for?

A: The Amaoe GLE1 stencil is specially designed for reballing or soldering the Google Tensor CPU (GLE1). It's commonly used in high-end Pixel smartphones and helps align solder balls or paste accurately during chip-level repair or CPU replacement.

Q2: Which devices is the GLE1 chip found in?

A: The GLE1 chip (Google Tensor) is typically found in Pixel 6 and Pixel 6 Pro smartphones. This stencil is ideal for technicians working on these models.

Q3: What is the material and quality of the stencil?

A: The stencil is made from premium stainless steel, providing high precision, heat resistance, and long-lasting durability for repeated use.

Q4: Is this stencil compatible with all types of soldering equipment?

A: Yes, it is compatible with most professional BGA rework stations and hot air soldering tools used in mobile repair labs.

Q5: What size solder balls should be used with this stencil?

A: For the Google Tensor CPU, 0.25mm or 0.3mm solder balls are typically used. Always check your chip’s specs or existing solder ball size for the most accurate match.