AMAOE X300P-012 VIVO X300 PRO STENCIL

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₹159 ₹400/pcs 60% off

Precision stencil for VIVO X300 Pro motherboard repairs.

Professional BGA reballing stencil for accurate IC soldering.

Durable stainless steel stencil for chip-level repair.

Laser-cut design ensures perfect solder ball alignment.

High-precision mobile motherboard repair stencil for technicians.

Reusable repair stencil with superior heat resistance.

Accurate IC positioning for reliable repair performance.

Professional mobile repair tool for advanced technicians.

Premium AMAOE stencil delivering consistent repair accuracy.

Essential BGA stencil for VIVO X300 Pro repairs.

AMAOE X300P-012 VIVO X300 PRO STENCIL

Product Description

The AMAOE X300P-012 VIVO X300 Pro Stencil is a premium-quality precision BGA reballing stencil specially designed for VIVO X300 Pro motherboard IC repair. Manufactured with high-grade stainless steel, this stencil provides accurate solder ball alignment, ensuring reliable reballing results for professional mobile phone technicians and repair centers.

Its ultra-precise laser-cut design offers excellent durability, heat resistance, and consistent positioning during soldering operations. Whether you're replacing damaged ICs, repairing motherboard faults, or performing advanced chip-level repairs, the AMAOE X300P-012 delivers professional-grade performance with maximum precision.

Ideal for mobile repair shops, electronics technicians, service centers, and advanced DIY users looking for dependable repair tools.


Specifications

Specification Details
Brand AMAOE
Model X300P-012
Product Name VIVO X300 Pro Reballing Stencil
Material Premium Stainless Steel
Compatibility VIVO X300 Pro
Application IC Chip Reballing
Technology Precision Laser Cut
Heat Resistance High Temperature Resistant
Reusable Yes
Suitable For Mobile Repair Professionals

Features

  • Precision laser-cut stainless steel construction
  • Designed specifically for VIVO X300 Pro
  • Accurate IC solder ball positioning
  • Excellent heat and wear resistance
  • Reusable professional repair stencil
  • High alignment accuracy
  • Durable anti-deformation material
  • Suitable for BGA chip repair
  • Easy to clean after use
  • Ideal for repair laboratories

Benefits

  • Improves soldering precision
  • Saves repair time
  • Reduces alignment errors
  • Produces professional repair results
  • Long-lasting reusable design
  • Compatible with professional repair stations
  • Enhances motherboard repair success rate
  • Suitable for daily workshop use
  • Reliable quality for technicians
  • Cost-effective repair solution


5 Bullet Points

  • Precision laser-cut stencil for accurate IC reballing.
  • Designed exclusively for VIVO X300 Pro motherboard.
  • Durable stainless steel for long-lasting professional use.
  • High-temperature resistant with excellent dimensional stability.
  • Ideal for mobile phone repair technicians and service centers.

 

Meta Description

Buy AMAOE X300P-012 VIVO X300 Pro BGA Reballing Stencil for accurate IC chip and motherboard repair. Premium stainless steel, laser-cut precision, reusable professional mobile repair tool.

AMAOE X300P-012 VIVO X300 PRO STENCIL

Weight

0.010

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