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Amaoe M15P-012 Stencil For Xiaomi 15Pro

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₹145 64% off ₹400

* Material: Japanese steel sheet

* Sternness: Super hard

* Hole  type: Square

* Re-usable: Yes

* Thickness: 0.12MM

     

Amaoe M15P-012 Stencil For Xiaomi 15Pro

 

Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.


Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.


Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.


Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.


Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

 

Amaoe M15P-012 Stencil for Xiaomi 15 Pro – FAQ

 

Q1: What is the Amaoe M15P-012 stencil used for?

A: The Amaoe M15P-012 stencil is specifically designed for reballing or soldering the main chipset of the Xiaomi 15 Pro smartphone. It ensures precise placement of solder balls during chip-level repairs.


Q2: What does “M15P-012” mean?

A:

  • M15P refers to the model (Xiaomi 15 Pro) that the stencil is designed for.

  • 0.12mm indicates the hole diameter, meaning it's optimized for 0.12mm solder balls, which are ideal for fine-pitch ICs.


Q3: Is this stencil only compatible with the Xiaomi 15 Pro?

A: Primarily, yes. The stencil is custom-designed for the Xiaomi 15 Pro’s chipset layout. It may not be suitable for other models due to differences in IC size and pad layout.


Q4: What is the material of the stencil?

A: The stencil is made from high-quality stainless steel, offering excellent heat resistance, precision, and durability for repeated use in professional mobile repair environments.


Q5: Can I use solder paste instead of solder balls?

A: Yes, you can use either solder paste or 0.12mm solder balls, depending on your reballing technique. However, solder balls are recommended for more uniform results with this stencil.

 

 

Weight

0.010

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