AMAOE M2-AMA4B/1420D Stencil is a high-precision BGA reballing template designed for accurate and professional mobile motherboard repair.

Built with durable stainless steel, this stencil ensures perfect alignment for reliable IC chip reballing and long-term use.

Ideal for mobile repair technicians, the AMAOE M2-AMA4B/1420D delivers clean, precise solder ball placement every time.

This professional reballing stencil helps simplify complex chip-level repairs and improves repair success rates.

Designed for advanced micro-soldering work, it provides accurate positioning for efficient smartphone motherboard repairs.

The AMAOE stencil is lightweight, compact, and perfect for daily use in mobile repair labs and service centers.

Engineered for precision and durability, it supports fast and efficient BGA rework and chip replacement.

A must-have tool for technicians performing CPU and IC reballing on modern smartphones.

Helps reduce soldering errors and increases repair accuracy for professional electronic repair workflows.

Perfect for beginners and experts alike, making chip reballing easier, faster, and more reliable.