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AMAOE MAC 11 STENCIL
The AMAOE MAC11 Stencil is a professional-grade, high-precision BGA (Ball Grid Array) reballing tool specifically engineered for Apple notebook CPUs. It is part of the AMAOE "M3 CPU Universal Series," designed to assist technicians in the intricate process of chip-level motherboard repair.
Below is the detailed product description in tabular format.
Product Overview: AMAOE MAC11 Stencil
| Feature | Description |
| Product Name | AMAOE MAC11 M3 CPU Universal Series BGA Reballing Stencil |
| Primary Application | BGA reballing and IC rework for Apple notebook CPUs |
| Material | High-grade, heat-resistant stainless steel |
| Stencil Thickness | 0.12mm (optimized for balance between flexibility and rigidity) |
| Manufacturing Tech | Advanced precision laser-cut technology |
| Reusability | Fully reusable; designed to withstand repeated high-temperature cycles |
| Compatibility | M3 CPU series (Apple Notebook) and specific logic board layouts |
| Key Benefits | Prevents solder bridging, ensures uniform solder ball size, and guarantees alignment |
Key Technical Specifications & Functional Details
| Technical Aspect | Details |
| Aperture Design | Precisely aligned holes that match the exact layout of BGA solder pads |
| Heat Resistance | Engineered to resist warping/deformation during high-heat soldering/reballing |
| Soldering Mediums | Compatible with standard solder paste and leaded/lead-free solder balls |
| Operational Goal | Enables consistent, professional-grade connections on high-density circuits |
| Handling | Lightweight and thin, allowing for easy placement and removal during the rework process |
| Weight |
0.020 |
|---|
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