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 The AMAOE MAC11 Stencil is a professional-grade, high-precision BGA (Ball Grid Array) reballing tool specifically engineered for Apple notebook CPUs. It is part of the AMAOE "M3 CPU Universal Series," designed to assist technicians in the intricate process of chip-level motherboard repair. Below is the detailed product description in tabular format.  Overview
Specifications
Technical Aspect
Details
Aperture Design
Precisely aligned holes that match the exact layout of BGA solder pads
Heat Resistance
Engineered to resist warping/deformation during high-heat soldering/reballing
Soldering Mediums
Compatible with standard solder paste and leaded/lead-free solder balls
Operational Goal
Enables consistent, professional-grade connections on high-density circuits
Handling
Lightweight and thin, allowing for easy placement and removal during the rework process
Product Overview: AMAOE MAC11 Stencil
Feature
Description
Product Name
AMAOE MAC11 M3 CPU Universal Series BGA Reballing Stencil
Primary Application
BGA reballing and IC rework for Apple notebook CPUs
Material
High-grade, heat-resistant stainless steel
Stencil Thickness
0.12mm (optimized for balance between flexibility and rigidity)
Manufacturing Tech
Advanced precision laser-cut technology
Reusability
Fully reusable; designed to withstand repeated high-temperature cycles
Compatibility
M3 CPU series (Apple Notebook) and specific logic board layouts
Key Benefits
Prevents solder bridging, ensures uniform solder ball size, and guarantees alignment
| Weight |
0.020 kg |
|---|
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