The AMAOE MG80P-012 Magic 80Pro Stencil is a high-precision BGA reballing stencil designed for professional mobile and PCB repair technicians.

Crafted from durable stainless steel, this stencil ensures accurate solder ball placement for reliable IC and CPU reballing work.

Perfect for smartphone motherboard repairs, the Magic 80Pro stencil offers precise hole alignment and long-lasting performance.

Designed for advanced rework stations, this stencil helps technicians perform clean and efficient chip reballing with ease.

The AMAOE Magic 80Pro stencil is an essential tool for mobile repair professionals seeking precision and durability.

Its ultra-fine mesh design allows accurate solder ball positioning, reducing repair time and improving success rates.

Ideal for both beginners and experts, this reballing stencil simplifies complex IC repair tasks.

Built for heavy daily use, the stencil provides heat resistance and consistent performance during soldering jobs.

A must-have accessory for electronics repair labs, ensuring professional results in BGA and SMD rework.

Upgrade your mobile repair toolkit with the AMAOE MG80P-012 stencil for faster, safer, and more precise chip repairs.