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AMAOE N970 012 FOR SAMSUNG NOTE 10 MIDDLE LAYER MOTHERBOARD REBALLING
Amaoe 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Multi Function Universal BGA Reballing Stencil
Stencils are often used in electronics manufacturing to apply solder paste to printed circuit boards (PCBs) during assembly, particularly for surface mount components. These stencils are typically custom-made to match the specific PCB design and component layout.
| Weight |
0.010 |
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