AMAOE S931-012 Stencil is a high-precision stainless steel reballing stencil designed for Samsung S25/S25+ and S931/S936 series motherboard chip repair.

This professional BGA stencil helps technicians perform accurate CPU and IC reballing for fast and reliable smartphone motherboard repairs.

Built with laser-cut precision, the AMAOE stencil ensures perfect solder ball alignment for Samsung S-series chip-level servicing.

Ideal for mobile repair shops, this stencil supports multiple Samsung models including S25, S25+, and S931 series for versatile use.

The durable stainless steel design offers long-lasting performance for repeated heating and rework operations.

Perfect for technicians and beginners, the stencil improves soldering accuracy and reduces chip repair time.

Compatible with micro-soldering tools, hot air stations, and rework stations used in professional phone repair labs.

This multi-model Samsung reballing stencil is a must-have tool for CPU, IC, and motherboard repair tasks.

Designed for chip-level repair, it ensures clean reballing results and stable performance after installation.

A reliable mobile repair accessory that boosts efficiency, precision, and success rate in smartphone servicing.