Amaoe WSR-1 Stencil For Wtr & Sdr ic
Stencil Purpose: Stencils are used for the precise application of solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.
Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.
Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.
Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.
Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.
Supported Model:-
WTR3905
WTR3925
WFR1620
WTR2605
WTR2100
WTR4905
WTR 4605
WTR2955
WTR2965
WFR2600
SMR526
WTR 1625/L
SDR845
SDX55M
SDR686
SDR865/868
SDR8150
WTR1605/L
0.4/45 0,35/45
WTR5975
SDR735
SDR660

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| Weight |
0.015 kg |
|---|

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