AMAOE WXCC-3 STENCIL

Product Description

The AMAOE WXCC-3 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone motherboard and IC chip repair. Manufactured from premium stainless steel, it offers excellent heat resistance, accurate hole positioning, and long-lasting durability for repeated use. The stencil ensures uniform solder ball placement, making it ideal for CPU, NAND, PMIC, and other BGA IC reballing applications.

Suitable for professional repair technicians and electronics workshops, the AMAOE WXCC-3 helps improve repair accuracy, reduce soldering errors, and increase repair efficiency. Compatible with hot air rework stations, solder paste, solder balls, and microscope-assisted repair work.

Specifications

Features

• High-quality stainless steel construction
• Precision laser-cut stencil openings
• Excellent heat and corrosion resistance
• Accurate BGA solder ball alignment
• Reusable professional repair stencil
• Ideal for motherboard IC reballing
• Suitable for repair laboratories
• Lightweight and durable design
• Smooth polished surface finish
• Compatible with hot air rework stations

Benefits

• Improves IC reballing accuracy
• Saves repair time
• Reduces soldering mistakes
• Ensures consistent solder ball placement
• Increases repair success rate
• Long-lasting professional quality
• Suitable for repeated daily use
• Supports precision motherboard repair
• Easy to clean after use
• Ideal for mobile repair technicians

5 Bullet Points

• Premium stainless steel precision reballing stencil.
• Accurate laser-cut openings for IC repair.
• High heat resistance for professional usage.
• Reusable design with excellent durability.
• Ideal for mobile motherboard repair technicians.

Meta Description

Buy the AMAOE WXCC-3 Stencil for professional BGA IC reballing and mobile motherboard repair.Precision stainless steel template for accurate solder ball placement with fast shipping across India