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JTX N3 BGA Planting Tin Reballing Stencil Platform Set with BGA110 / BGA315 Stencil Features: Package includes:Overview
NAND Reballing / Expansion Tools / Precise Alignment
More Powerful: Supports multiple NAND Reballing
Precise Alignment Efficient Operation: High Precision Nand Notch Efficient Reballing
Capacity Expansion Tools Specialized for Reballing: Nand Reballing mesh-laser drilled holes
Apple Reballing IC Soldering Platform: Apple Nand Reballing Platform
Built-in strong magnet, Tighten without falling off: Strong suction-no need for clips-easy to access
Easy to operate, Secure clamping
High Temperature Resistant: High Strength Dirt Resistant, Easy to Clean
Rubber Foot Mats: Wear-resistant, anti-slip, shock-absorbing, anti-pressure, anti-aging
1 x Base
1 x Stencil
| Weight |
0.0150 kg |
|---|
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