Jtx T4 Pro Chips Glue Removal And Reballing Platform For IOS And Android 

Features:

• T4 Pro degumming and tin planting platform, support Apple/Huawei/OPPO/VIVO/Honor/Xiaomi/Samsung and other models, a total of 84 models of chips
• The 2-in-1 design greatly helps the maintenance master save costs and improve tin plant efficiency
• Magnetic automatic clamping, universal 3D planting tin net, removing glue card, accurate positioning
• Clamping precision, more stable operation, not easy to damage the chip
• Using a new type of magnetic dynamic positioning, strong magnetic clamping stable, automatic alignment
• It has wear-resistant, anti-slip, shock-absorbing, anti-aging, non-toxic tasteless and high temperature resistance
• Selected high-quality steel, fine workmanship, wear resistance, high hardness Support tin planting
• Support unlimited expansion, a total of 84+ types of chips

Supported models:-

• Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845, SM665, SM6150, SM8750, SM730G, SM7150,SM680, SM6225, SM7475, SM6450, SM720, SM7125
• Dimensions: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300
• Android RAM: BGA 376, BGA 436, BGA 496, BGA 556
• Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820
• Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G
• Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18, A18 Pro

Packaging Details' :

1. 1 x Fixture
2. 14 x Stencil