High Precision Blades – Specially designed for clean and safe removal of glue, adhesive, and resin from CPUs, IC chips, NAND, and BGA. Professional-Grade Quality – Hand-polished tips ensure smooth operation without damaging delicate components. Durable & Heat-Resistant – Made from strong materials to withstand high-temperature repair environments. Comfortable Handling – Ergonomic non-slip grip provides stability and reduces hand fatigue during long repair sessions. Wide Applications – Perfect for mobile phone motherboard repairs, electronics disassembly, chip-level work, and fine detailing tasks. Portable & Compact – Lightweight design makes it easy to carry and store in your repair toolkit.Overview


| Weight |
0.100 kg |
|---|

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