Maant Universal Black Stencil

Premium Quality Build – Made from high-grade stainless steel with a black coating for durability and long-lasting performance.

Universal Compatibility – Supports a wide range of mobile ICs and chips, making it suitable for multiple phone brands and models.

High Precision Design – Perfectly aligned micro-holes ensure accurate solder ball placement for clean and reliable reballing.

Heat Resistant & Durable – Designed to withstand high reflow temperatures without warping or damage, ensuring consistent results.

Professional Repair Tool – Essential for BGA reballing, IC chip repair, motherboard maintenance, and soldering applications.

Reusable & Cost-Effective – Can be used multiple times, providing excellent value for technicians and repair shops.