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Max Gold 550 Micro Soldering Pen
1. Product Verification & Core Blueprint
| Identification Metric | Technical Profile & Details |
| Brand Name | MAX GOLD / MAX AUTOMATION |
| Model Designation | 550 Micro Soldering Pen (M-550 / Gold 550) |
| Hardware Classification | Low-Voltage Micro-Soldering Instrument |
| Primary Design Intent | Micro-soldering, SMD rework, mobile motherboard jumping, and FPC connector repair |
| Ergonomic Profile | Ultra-slim, pen-style "Short Handle" design for maximum finger-tip control |
| Build Materials | High-grade heat-resistant polymer handle with high-conductivity copper core element housing |
2. Electrical Power & Safety Parameters
| Electrical Attribute | Value / Performance Threshold |
| Input Operating Voltage | 12\V DC (Derived via isolated step-down circuit from host station) |
| Power Consumption Scope | Highly efficient 15W output (with variable capability up to 30W thermal equivalent) |
| Electrical Leakage Threshold | 0V AC Leakage due to the step-down safety transformer |
| Safety Standard | ESD Safe & Fully Shock-Proof (Guarantees zero static damage to sensitive PMIC/CPU IC chips) |
| Energy Saving Metric | Reduces power consumption by up to 53% to 55% compared to standard 25W line-voltage irons |
3. Thermal Dynamics & Bit Configuration
| Thermal & Bit Metric | Specifications |
| Operational Temp Range | 65ºCo 450ºC (Continuously variable matching node) |
| Heating Element Type | Micro Ceramic Metal-Ceramic Heater (MCH Core) |
| Thermal Recovery Rate | Rapid response; recovers dropped heat profile within seconds of pad touch |
| Default Included Bit Profile | Ultra-fine Needle Point Pointed Bit (Aluminium-coated multi-layer composite) |
| Element Shaft Diameter | Clear 2.5mmultra-slim profile for tight SMD component navigation |
| Bit Replacement Connection | Screw-collar terminal lock for quick-swap mechanical bits |
4. Mechanical Structure & Logistics Data
| Structural Metric | Dimension / Commercial Parameter |
| Handle Diameter | Approx. 11tem - 13mm (mimics standard technical drawing pen) |
| Pen Net Weight | Extremely lightweight (approx. 45g - 55p without cord assembly) |
| Interface Connector | Specialized multi-pin / RCA male jack plug configuration (model variant dependent) |
| Cord Material Length | 1.2 Meters high-flexibility, anti-burn silicone insulated cable |
| Estimated Product Lifespan | > 1000 continuous operational heating hours under bench loads |
5. Micro-Soldering Target Application Profiles
| Hardware Rework Substrate | Success Execution Profile |
| Mobile Phone Repair | Ideal for micro-jumper tracking, repairing fractured trace lines, and rebuilding individual pads under micro-scopes. |
| FPC Connectors | Precise, localized thermal transfer prevents structural warping of delicate plastic connector walls. |
| SMD / SMT Rework | Seamlessly drops, tacks, and re-flows 0402 and 0201 passives without shifting adjacent chips. |
| Jewelry & Wax Modeling | Low thermal ceiling threshold allows precise wax shaping and miniature metal spot joining. |
6. Commercial Package Packing List
| Item Component | Box Quantity | Operational Function |
| Max Gold 550 Soldering Pen | 1 Unit | Core replacement handpiece pen with cable |
| Pointed Micro Bit (Pre-installed) | 1 Unit | Micro needle point tip for intricate board repairs |
| Host Connectivity Adapter Jack | 1 Unit | Embedded link terminal connection line |
| Instructional Manual Leaflet | 1 Piece | Quick reference calibration matrix |
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| Weight |
0.06 |
|---|
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