MECHANIC P23 FLUX PASTE 10CC
Mechanic P23 10CC Mobile Phone Motherboard Chip Rework Special Flux Paste
Features:
1. Chip rework special flux paste, lead-free environmental protection / non-resistance / anti-oxidation / no cleaning / very strong solder ability / excellent wet ability
2. P23 chip rework special solder oil, specially developed for cell phone motherboard chip and mid-layer rework
3. Specially developed for cell phone motherboard chip and mid-layer rework using high activity, low halogen lead-free material, moderate fluidity
4. High-temperature heating, good material wet ability, perfect for chip disordering, completely non-destructive, no damage to the motherboard and chip
5. Specially developed for high-end models of motherboard chip substrate, with the soldering iron and soldering tape rework cleaning pad/drag tin
6. High-temperature heating for pad residue gel removal, better rework effect, no residue
7. Ergonomic design, tailor-made, comfortable to help push, convenient and labor-saving
8. Chip back to solder with obvious effect, can enhance the chip pins and the pad back to the adhesion of the solder
9. Realize the chip back to the solder automatically cut back to the right, especially for the chip BGA back to the solder back to the effect is more significant
Packing Details:
- * 1xMECHANIC P23 FLUX PASTE 10CC
Weight |
0.050 |
---|
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