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MECHANIC P59 FLUX PASTE 10CC
MechanicP59 10CC Mobile Phone Motherboard Chip Rework Special Flux Paste
Features:
1. Chip rework special flux paste, lead-free environmental protection / non-resistance / anti-oxidation / no cleaning / very strong solderability / excellent wettability
2. P59 chip re-solder special solder oil, specially developed for cell phone motherboard chip and mid-level re-solder
3. Specially developed for cell phone motherboard chip and mid-layer rework using high activity, low halogen lead-free material, moderate fluidity
4. High-temperature heating, good material wettability, perfect for chip desoldering, completely non-destructive, no damage to the motherboard and chip
5. Specially developed for high-end models of motherboard chip substrate, with the soldering iron and soldering tape rework cleaning pad/drag tin
6. High-temperature heating for pad residue gel removal, better rework effect, no residue
7. Ergonomic design, tailor-made, comfortable to help push, convenient and labor-saving
8. Chip back to solder with obvious effect, can enhance the chip pins and the pad back to the adhesion of the solder
9. Realize the chip back to the solder automatically cut back to the right, especially for the chip BGA back to the solder back to the effect is more significant.
Packing Details:
- * 1xMECHANIC P59 FLUX PASTE 10CC
| Weight |
0.050 |
|---|
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