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MECHANIC S45-A11 3D BLACK STENCIL
Feature:
High-temperature resistance can be used 100000 times
3D groove design enables the stencil to align with the tinning position of the IC rapidly.
The square hole design makes it easier to take out the formed solder balls.
This 3D stencil is easy to use no matter if you are a new expert.
With the high success rate of planting tin, the solder balls can be formed once you are proficient.
Square rounded hole design
High-temperature resistance up to 700°C
| Weight |
0.010 |
|---|
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