MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET

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₹798 ₹1800/pcs 56% off

Solve the pop-up problem after the screen replacing,
polish the screen IC to protect the flex cable from damage,
adding function of IC tin planting, more convenient and fast
With the support of iPhone screen protector,
technicians can focus more on polishing the screen IC,
no need to be distracted by the constant worry of damaged flex cable
IC chip tinning, high temperature resistance, no deformation
Using advanced tin planting technology,
ensure that every tin point all fall exactly on the designated location of the IC chip
This not only greatly improves the success rate of tin planting,
but also reduces the risk of damage to the chip caused by improper tin planting

MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET

The mechanic UFO Series BGA Reballing Stencil is designed to repair Qualcomm MTK motherboard IC chip. Constructed from high-quality steel, this 90*90mm stencil ensures accurate reballing for various Qualcomm models.

Mechanic CPU UFO Qualcomm MTK 9 pcs set Stencils

Mechanic UFO Qualcomm MTK Stencils

Weight	0.110

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MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET

MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET

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