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MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET
MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET

MECHANIC 9-IN-1 UFO BGA REBALLING STENCIL FOR MTK 9 PCS SET

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₹798 ₹1800/pcs 56% off

  • Solve the pop-up problem after the screen replacing,
  • polish the screen IC to protect the flex cable from damage,
  • adding function of IC tin planting, more convenient and fast
  • With the support of iPhone screen protector,
  • technicians can focus more on polishing the screen IC,
  • no need to be distracted by the constant worry of damaged flex cable
  • IC chip tinning, high temperature resistance, no deformation
  • Using advanced tin planting technology,
  • ensure that every tin point all fall exactly on the designated location of the IC chip
  • This not only greatly improves the success rate of tin planting,
  • but also reduces the risk of damage to the chip caused by improper tin planting

Quantity
1
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In stock ·Brand Mechanic Stencil ·SKU 9196
  • Delivery Shipping calculated at checkout
  • 7-day returns Return by mail · customer pays return shipping
  • Secure payment Secure payment options

Overview

 

The mechanic UFO Series BGA Reballing Stencil is designed to repair Qualcomm MTK motherboard IC chip. Constructed from high-quality steel, this 90*90mm stencil ensures accurate reballing for various Qualcomm models.

Mechanic CPU UFO Qualcomm MTK 9 pcs set Stencils

 

Mechanic UFO Qualcomm MTK Stencils Mechanic UFO Qualcomm MTK Stencils

 

Weight

0.110 kg
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