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RELIFE RL-088 MAGNETIC BASE
Relife RL-088 Tin-planted Universal Magnetic Base for Mobile Phone BGA Soldering Repair
Features:
- RL-088 tin-planted universal magnetic fixture, say goodbye to paper towel planting tin, which can be used for chip positioning and adhesive removal, and strong magnetic adsorption for tin planting
- It has the characteristics of anti-static, strong magnetic adsorption, high-temperature resistance, steel plate weight gain, chemical corrosion resistance, etc
- Multifunctional double-sided double-use, it is suitable for repairing motherboards of different shapes, general tin planting of various BGA chips, etc
- Front side - suitable for all kinds of BGA chips; Reverse side - suitable for different shapes of motherboards
- Various types of tin-planting stencils are commonly used, which can effectively avoid the phenomenon of tinning on the bottom of the stencil due to heating and swelling
- Multifunctional position adjustment, decompression protection, tin planting automatically balances the stencil and decompress it, effectively protecting the chip and making it safer
- New silicone material, high-temperature resistance without bulging, flame retardant, corrosion resistance
- Insulating material, with good anti-collision / anti-skid / anti-acid properties, and wear-resistant and easy to clean
- Embedded high-temperature magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism unchanged
- High hardness weight-added steel, strong anti-deformation ability, high-quality carbon steel material, not afraid of corrosion
| Weight |
0.750 |
|---|
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