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  Feature:  1. Specially formulated BGA flux paste for lead-free electronics soldering. 2. Rosin-based flux for effective soldering and flux removal. 3. Comes in a convenient 20ml container for easy application. 4. Ensures strong and reliable solder joints. 5. Suitable for a wide range of electronics soldering applications.  Packing Details:     Overview
The RELIFE RL-429 BGA Flux Paste is a 20ml content soldering flux designed for use with BGA (Ball Grid Array) components. It aids in soldering and ensures reliable connections.
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| Weight |
0.05 kg |
|---|
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