RELIFE TO6 DESOLDERING NEEDLE SET

Relife TO6 Pure Copper with Gold Plating Desoldering Needle Set for BGA Package Chip Desoldering
 

Features:

• TO6 pure copper with gold plating desoldering needle set, specially designed for motherboard repair desoldering, with a spherical head design that does not scratch or damage sockets and motherboards, especially suitable for BGA package chip desoldering

• Even and Fast, Full Tinning: Pure copper gold-plated desoldering needle set, especially suitable for BGA package chip desoldering

• Pure Copper Gold-plated Needle Tip: The needle tip uses high-purity copper with gold plating, improving tinning speed by 50%

• Round Sphere Design: The round ball head design is smooth without edges, does not scratch or damage sockets and the motherboard

• Simple And Convenient Operation: It can be operated conveniently even in narrow spaces, without easily scratching inline sockets

Package includes:

• 1 x Handle

• 5 x Needles
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