AMAOE X300-012 VIVO X300 STENCIL
Amaoe X300-012 0.12mm Middle Layer BGA Reballing Stencil for VIVO X300
Package includes:
- 1 x Stencil

| Weight |
0.020 |
|---|
AMAOE X300-012 Vivo X300 Stencil is a precision stainless-steel template designed for accurate BGA reballing and chip repair on Vivo X300 motherboards. Ideal for professional mobile technicians.
High-quality AMAOE X300-012 stencil ensures perfect solder ball alignment for Vivo X300 IC rework, improving repair success and saving time in mobile service jobs.
This Vivo X300 reballing stencil is made from durable thin steel, providing excellent heat resistance and long-lasting performance for daily repair work.
Designed for chip-level repairs, the AMAOE X300-012 helps technicians perform precise CPU and IC reballing on Vivo X300 devices with ease.
Professional mobile repair tool featuring accurate cutouts for smooth solder paste application and clean reballing results on Vivo X300 boards.
The AMAOE Vivo X300 stencil is perfect for mobile repair shops, ensuring reliable, fast, and efficient motherboard IC repair.
Lightweight and reusable, this stencil is ideal for technicians who need consistent performance for Vivo X300 BGA rework tasks.
Achieve high-precision micro-soldering results with the AMAOE X300-012 stencil, engineered for expert smartphone repair professionals.
A must-have GSM repair accessory for accurate chip alignment, helping reduce repair errors and increase productivity.
Built for durability and precision, this Vivo X300 stencil is the perfect addition to any mobile phone repair toolkit.
Amaoe X300-012 0.12mm Middle Layer BGA Reballing Stencil for VIVO X300
Package includes:
- 1 x Stencil

| Weight |
0.020 |
|---|
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