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The AMAOE BGA Reballing Stencil is a precision-engineered tool designed specifically for the professional repair of AMD graphics chipsets bearing the part number 215-0929006. Crafted by AMAOE—a leader in the micro-soldering and repair tooling industry—this stencil facilitates efficient, reliable, and high-accuracy tin planting for BGA (Ball Grid Array) components. It is an essential asset for technicians performing GPU refurbishment or motherboard-level repairs where precision and thermal stability are paramount.  Overview
Key Features
Advantage
Benefit to Technician
Precision Engineering
The laser-cut apertures align perfectly with the BGA contact pads of the 215-0929006 chip, reducing the risk of solder bridges.
Anti-Deformation
The specialized metal alloy maintains its structural integrity during repeated heating cycles, ensuring longevity.
Optimal Solder Flow
The smooth internal surfaces of the stencil holes facilitate an even flow of solder paste, ensuring uniform sphere formation across all pins.
Thermal Stability
Resistant to the thermal shock associated with professional hot air rework stations.
Ease of Use
Compatible with standard reballing platforms and manual positioning frames.
Specifications
Feature
Specification Details
Brand
AMAOE
Compatible Chip
AMD Graphics Chipset (Part: 215-0929006)
Stencil Thickness
0.25mm (Optimized for standard solder ball size)
Material
High-Grade Stainless Steel / Alloy
Heat Resistance
High-temperature resistant; non-deforming under rework heat
Production Technology
Laser-cut precision, chemically etched for smooth hole walls
Hole Geometry
Optimized for consistent solder paste deposit
Application
GPU Refurbishment, BGA Reballing, Chipset Repair
Usage & Maintenance Guidelines
Step
Instruction
Cleaning
Always clean the stencil with Isopropyl Alcohol (IPA) after each use to remove residual flux or solder.
Handling
Avoid bending or scratching the stencil surface; store in a protective sleeve or organized stencil tray.
Setup
Ensure the stencil is perfectly aligned with the chip's orientation markers (pin 1) before applying solder paste.
Heating
Use with a high-quality leaded or lead-free solder paste depending on your specific refurbishment requirements.
| Weight |
0.020 kg |
|---|
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