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AMAOE AMD 215-0929006 STENCIL
The AMAOE BGA Reballing Stencil is a precision-engineered tool designed specifically for the professional repair of AMD graphics chipsets bearing the part number 215-0929006. Crafted by AMAOE—a leader in the micro-soldering and repair tooling industry—this stencil facilitates efficient, reliable, and high-accuracy tin planting for BGA (Ball Grid Array) components. It is an essential asset for technicians performing GPU refurbishment or motherboard-level repairs where precision and thermal stability are paramount.
Technical Specifications
| Feature | Specification Details |
| Brand | AMAOE |
| Compatible Chip | AMD Graphics Chipset (Part: 215-0929006) |
| Stencil Thickness | 0.25mm (Optimized for standard solder ball size) |
| Material | High-Grade Stainless Steel / Alloy |
| Heat Resistance | High-temperature resistant; non-deforming under rework heat |
| Production Technology | Laser-cut precision, chemically etched for smooth hole walls |
| Hole Geometry | Optimized for consistent solder paste deposit |
| Application | GPU Refurbishment, BGA Reballing, Chipset Repair |
Key Product Features & Benefits
| Advantage | Benefit to Technician |
| Precision Engineering | The laser-cut apertures align perfectly with the BGA contact pads of the 215-0929006 chip, reducing the risk of solder bridges. |
| Anti-Deformation | The specialized metal alloy maintains its structural integrity during repeated heating cycles, ensuring longevity. |
| Optimal Solder Flow | The smooth internal surfaces of the stencil holes facilitate an even flow of solder paste, ensuring uniform sphere formation across all pins. |
| Thermal Stability | Resistant to the thermal shock associated with professional hot air rework stations. |
| Ease of Use | Compatible with standard reballing platforms and manual positioning frames. |
Usage & Maintenance Guidelines
| Step | Instruction |
| Cleaning | Always clean the stencil with Isopropyl Alcohol (IPA) after each use to remove residual flux or solder. |
| Handling | Avoid bending or scratching the stencil surface; store in a protective sleeve or organized stencil tray. |
| Setup | Ensure the stencil is perfectly aligned with the chip's orientation markers (pin 1) before applying solder paste. |
| Heating | Use with a high-quality leaded or lead-free solder paste depending on your specific refurbishment requirements. |
| Weight |
0.020 |
|---|
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