AMAOE BGA2138 STENCIL

Product Description

The AMAOE BGA2138 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone motherboard and IC chip repair. Manufactured from premium stainless steel, this stencil provides exceptional durability, accurate alignment, and consistent solder ball placement for efficient BGA reballing.

Its precision laser-cut openings ensure smooth soldering while reducing alignment errors, making it suitable for technicians repairing smartphones, tablets, and electronic devices. The stencil is reusable, heat-resistant, corrosion-resistant, and ideal for professional repair labs and service centers.

Whether you're replacing damaged ICs or performing advanced motherboard repairs, the AMAOE BGA2138 Stencil delivers reliable performance, precise solder ball positioning, and long-lasting durability.

Specifications Table

Features

• High-quality stainless steel construction
• Precision laser-cut BGA openings
• Accurate IC chip alignment
• Heat and corrosion resistant
• Reusable professional repair stencil

Benefits

• Produces accurate solder ball placement
• Reduces repair time and alignment errors
• Improves successful IC reballing
• Suitable for repeated professional use
• Ideal for advanced motherboard repairs

5 Bullet Points

• Premium stainless steel precision reballing stencil.
• Accurate laser-cut openings for IC repair.
• Durable, reusable, and heat resistant.
• Professional quality for motherboard servicing.
• Perfect for mobile phone BGA rework.