AMAOE K90PM-012 K90 PRO MAX STENCIL

The AMAOE K90PM-012 K90 PRO MAX Stencil is a professional-grade, high-precision BGA (Ball Grid Array) reballing tool engineered for advanced motherboard and component-level repairs. Designed specifically for micro-soldering technicians, it facilitates the accurate application of solder paste to motherboard layers and integrated circuits (ICs), ensuring high success rates in complex smartphone hardware restoration.

Product Overview

This stencil is part of AMAOE’s specialized lineup, manufactured using premium stainless steel and laser-cutting technology to withstand high-temperature reflow environments without warping.

Key Technical Benefits

• High-Precision Alignment: The laser-cut apertures are perfectly calibrated to the pin layout of the specific motherboard layers or ICs, minimizing the risk of solder bridging or misalignment.

• Durability: Unlike cheaper alternatives, the stainless steel construction resists heat-induced deformation, allowing for repeated, consistent use across multiple repair jobs.

• Optimal Thickness (0.12mm): This specific thickness strikes the perfect balance for structural integrity during the scraping process while remaining thin enough to allow for accurate solder paste transfer onto the PCB pads.

• Efficiency: Designed to streamline the reballing workflow, it enables technicians to apply solder paste evenly and quickly, significantly reducing manual rework time.

Usage Instructions for Professionals

1. Preparation: Ensure the BGA chip or motherboard surface is thoroughly cleaned of residual solder, flux, and debris.

2. Alignment: Place the stencil over the component, ensuring all apertures perfectly align with the target pads. Use a heat-resistant fixture or magnet if available to hold it steady.

3. Application: Apply a thin, uniform layer of high-quality solder paste over the stencil apertures using a metal scraper. Ensure the paste is pushed fully into the holes without creating bridges.

4. Reflow: Carefully remove the stencil, inspect the paste deposition, and proceed with controlled heat application (using a rework station/hot air gun) to reflow the solder balls.