AMAOE M5 CPU STENCIL
The AMAOE M5 series (often referred to as MU-5 or related variants) is a professional-grade, high-precision BGA (Ball Grid Array) reballing stencil. It is engineered specifically for technicians involved in advanced smartphone motherboard repairs, focusing on MediaTek (MTK) and, in some variants, Qualcomm chipsets.
These stencils are essential for "reballing"—the process of replacing the solder balls on the underside of a CPU or IC (Integrated Circuit) to ensure a secure, functional connection to the motherboard.
AMAOE M5 Series: Technical Overview
| Feature | Specification Details |
| Brand | AMAOE |
| Primary Material | High-Quality Stainless Steel (Super-hardened) |
| Thickness | 0.12 mm (Industry standard for precision flow) |
| Compatible Chipsets | MediaTek (MTK) Dimensity/Helio series; certain variants support Qualcomm |
| Aperture Technology | Laser-cut, half-etched micro holes |
| Key Function | BGA Reballing and Solder Paste Application |
| Thermal Resistance | High-temperature resistant (prevents warping during rework) |
| Design Type | Square/Round hole alignment for uniform solder distribution |
| Reusable | Yes, designed for multiple rework cycles |
| Primary Application | Smartphone CPU/RAM IC repair and motherboard refurbishment |
Usage Instructions
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Alignment: Secure the CPU/IC and align the stencil apertures precisely with the chip's solder pads.
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Paste Application: Apply a thin layer of high-quality solder paste over the stencil using a precision scraper or blade.
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Reflow: Apply controlled heat using a hot air rework station. The high-temperature resistant properties of the AMAOE steel ensure the stencil does not lift or warp, keeping the solder balls in place during the reflow process.
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Cleaning: Once cooled, carefully lift the stencil and clean with a suitable solvent to remove any excess flux or solder debris.

| Weight |
0.020 |
|---|

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