Precision Reballing Tool – AMAOE P80-012 Pura 80 Stencil is designed for accurate IC and CPU reballing, ensuring perfect alignment and reliable soldering results for professional mobile repair.

High-Quality Stainless Steel – Made with durable, heat-resistant steel for long-lasting performance and consistent precision during repeated repair work.

Perfect Fit for Pura 80 – Specially engineered stencil for Pura 80 motherboard chip reballing, helping technicians achieve factory-level repair quality.

Ultra-Thin Laser Cut Design – Micro-precision laser cutting ensures accurate hole positioning for smooth and efficient solder ball placement.

Professional GSM Repair Tool – Ideal for mobile repair technicians, service centers, and DIY experts working on advanced smartphone motherboard repairs.

Fast & Efficient Reballing – Simplifies BGA reballing and reduces repair time while improving solder joint accuracy and stability.

Heat Resistant & Durable – Withstands high temperatures during rework and soldering processes without warping or losing precision.

Reliable Chip Alignment – Ensures proper IC alignment to prevent short circuits and improve repair success rates.

Compact & Easy to Use – Lightweight and portable design makes it convenient for daily repair tasks in workshops or service labs.

Essential Mobile Repair Accessory – A must-have stencil for professionals seeking precision, efficiency, and high-quality smartphone motherboard repair results.