AMAOE SSD-2 STENCIL

Amaoe SSD-2 Stencil

Stencil Purpose: Stencils are used to apply solder paste to solder pads on a PCB precisely. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component's pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

Supported Model:-

DDR4-BGA78

DDRS-BGA82

DDR4-BGA96

DDR5-BGA102

NAND-BGA272

1620 SSD-BGA291

NAND-BGA316

NAND-BGA132

NAND-BGA152

NAND-BGA178

NAND-BGA154